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  • dx fluidics

Dx Fluidics Environmental Equipment & Supplies

4 equipment items found

DX Fluidics - Droplet Microfluidic Chip for Laboratory and Clinical Applications

DX Fluidics - Droplet Microfluidic Chip for Laboratory and Clinical Applications

Manufactured by:DX Fluidics   based inSuzhou, CHINA
Droplet microfluidic chips represent a significant advancement in microfluidic technology by facilitating complex biological and chemical experiments through the precise control of droplets on a micron scale. Integrating microfluidics with chemical analysis and biology, these chips automate and miniaturize experiments, enhancing laboratory research and clinical diagnostics. The core technology ...
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DX Fluidics - Syringe Pump

DX Fluidics - Syringe Pump

Manufactured by:DX Fluidics   based inSuzhou, CHINA
A syringe pump is a device for controlling precise liquid flow and flow rate based on a stepper motor as a drive source. It typically consists of a stepper motor, a pump head and a controller. The stepper motor provides precise speed and position control, the pump head is used to push the fluid into the line, and the controller controls the angle and speed of motor ...
CONTACT SUPPLIER

DX Fluidics - Photolithography Machine/Exposure System Category: Devices

DX Fluidics - Photolithography Machine/Exposure System Category: Devices

Manufactured by:DX Fluidics   based inSuzhou, CHINA
The desktop microlithography machine by Top Asahi is engineered for micron-level precision in patterning applications. It employs a UV LED cold light source paired with a double aspherical quartz lens, resulting in parallel light with a half angle less than 2°. This feature, combined with its ultra-compact size fit for desktop placement, enhances convenience and accuracy. Ideal for ...
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DX Fluidics - Hot Press Bonding Machine

DX Fluidics - Hot Press Bonding Machine

Manufactured by:DX Fluidics   based inSuzhou, CHINA
The Hot Press Bonding Machine designed for the preparation of microfluidic chips is specifically used for bonding plastic chips (such as PMMA, PC, COC, etc.) to achieve chip encapsulation and integration. This bonding machine employs vacuum hot press technology, characterized by high efficiency, precision, and reliability, making it suitable for various packaging and integration ...
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